Samsung Electronics Co. has unveiled new memory chips designed to boost artificial intelligence capabilities in smartphones, data centers, and other devices. The new chips, called HBM3 and AM670, are aimed at enhancing AI performance and efficiency. HBM3 is a high-bandwidth memory chip that can transfer data at a rate of 6.4 gigabytes per second, enabling faster processing for AI tasks. AM670 is a mobile memory chip that can improve AI performance in smartphones by up to 50% compared to previous chips. Samsung plans to use these chips in its upcoming Galaxy S24 flagship smartphone and other AI-focused products. The company aims to capitalize on the growing demand for AI capabilities across various industries, including mobile devices, data centers, and autonomous vehicles. The new memory chips are expected to provide a competitive edge for Samsung in the AI hardware market.
Samsung Aims to Boost AI Capabilities with New Memory Chips
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